Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip–package interaction; a numerical investigation

Microelectronics Reliability (2016) - Comments
doi: 10.1016/j.microrel.2016.01.015 issn: 0026-2714

Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tőkei