Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array
Microelectronics Reliability (2016) - 0 Comments
doi: 10.1016/j.microrel.2016.10.001  issn: 0026-2714 

Fei Chong Ng , Aizat Abas , MHH Ishak , MZ Abdullah , Abdul Aziz

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