Hybrid Si/TMD 2D electronic double channels fabricated using solid CVD few-layer-MoS2 stacking for Vth matching and CMOS-compatible 3DFETs
2014 IEEE International Electron Devices Meeting (2014) - Comments
doi: 10.1109/iedm.2014.7047163 

Min-Cheng Chen, Chia-Yi Lin, Kai-Hsin Li, Lain-Jong Li, Chun-Chi Chen, Cheng-Hao Chuang, Ming-Dao Lee, Yi-Ju Chen, Yun-Fang Hou, Chang-Hsien Lin, Chun-Chi Chen, Bo-Wei Wu, Cheng-San Wu, Ivy Yang, Yao-Jen Lee, Wen-Kuan Yeh, Tahui Wang, Fu-Liang Yang, Chenming Hu