Hybrid Si/TMD 2D electronic double channels fabricated using solid CVD few-layer-MoS2 stacking for V&lt;inf&gt;th&lt;/inf&gt; matching and CMOS-compatible 3DFETs

Min-Cheng Chen; Chia-Yi Lin; Kai-Hsin Li; Lain-Jong Li; Chun-Chi Chen; Cheng-Hao Chuang; Ming-Dao Lee; Yi-Ju Chen; Yun-Fang Hou; Chang-Hsien Lin; Chun-Chi Chen; Bo-Wei Wu; Cheng-San Wu; Ivy Yang; Yao-Jen Lee; Wen-Kuan Yeh; Tahui Wang; Fu-Liang Yang; Chenming Hu

Hybrid Si/TMD 2D electronic double channels fabricated using solid CVD few-layer-MoS2 stacking for V<inf>th</inf> matching and CMOS-compatible 3DFETs

2014 IEEE International Electron Devices Meeting (2014) - Comments
doi: 10.1109/iedm.2014.7047163

Min-Cheng Chen, Chia-Yi Lin, Kai-Hsin Li, Lain-Jong Li, Chun-Chi Chen, Cheng-Hao Chuang, Ming-Dao Lee, Yi-Ju Chen, Yun-Fang Hou, Chang-Hsien Lin, Chun-Chi Chen, Bo-Wei Wu, Cheng-San Wu, Ivy Yang, Yao-Jen Lee, Wen-Kuan Yeh, Tahui Wang, Fu-Liang Yang, Chenming Hu