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Changsoo Jang, Seongyoung Han, Hangyu Kim, Sayoon Kang
Search publications for: doi:10.1016/J.MICROREL.2005.06.013 1 result
A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process
Changsoo Jang, Seongyoung Han, Hangyu Kim, Sayoon Kang