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K.N. Tu, Hsiang-Yao Hsiao, Chih Chen
Search publications for: doi:10.1016/J.MICROREL.2012.07.029 1 result
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
K.N. Tu, Hsiang-Yao Hsiao, Chih Chen