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A. Ikeda, L. J. Qiu, K. Nakahara, T. Asano
Search publications for: doi:10.1109/3DIC.2013.6702317 1 result
Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding
A. Ikeda, L. J. Qiu, K. Nakahara, T. Asano