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Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tőkei
Search publications for: doi:10.1016/J.MICROREL.2016.01.015 1 result
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip–package interaction; a numerical investigation
Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tőkei